Customer Service

+1-763-312-8836

Contact

Support

Feedback

Are You Using CT Scanning to Streamline Electronics Inspection & Failure Analysis for Defense Applications?

Posted on December 1, 2025

Modern defense systems, from advanced guidance electronics to ruggedized communication modules, depend on densely packed, highly complex electronic assemblies. As components shrink and architectures grow more layered, traditional inspection methods often fall short of delivering the insight required to ensure reliability and mission readiness.

Computed Tomography (CT) has rapidly become a cornerstone technology for defense OEMs and research facilities that cannot afford uncertainty. With its ability to visualize, measure, and analyze internal features without disassembly or destructive testing, CT brings new clarity to the most challenging electronic assemblies.

 

The Growing Complexity of Defense Electronics

Defense-grade electronics present unique inspection demands:

  • Stacked microelectronic architectures with multiple internal layers
  • Encapsulated or potted assemblies designed for ruggedization
  • Fine-pitch interconnects and solder joints that are difficult to access
  • Embedded components inside multi-chip modules, PCBs, sensors, and power electronics

High resolution CT imaging provides imaging of these challenging components, ensuring quality, performance, and lifecycle readiness.

 

Using CT to Detect Failure Modes Earlier and More Accurately

Defense customers rely on CT because it reveals defects that 2D X-ray and optical inspection simply cannot see. Common failure modes that CT identifies include:

  • Voids in solder joints
  • Cracked vias or microvias
  • Delamination in multi-layer PCBs
  • Bent, broken, or lifted leads
  • Foreign materials or debris
  • Heat-related structural deformation

Using 3D visualization, engineers can not only find flaws but also identify the root cause faster and more accurately, reducing the guesswork in diagnosing failures.

 

Accurately Measuring Sub-Layer Components

One of the greatest strengths of CT is its ability to quantify features at any depth of a component—without cutting into the assembly.

CT imaging allows defense engineers to:

  • Measure vias, solder joints, bond wires, and conductive traces in true 3D
  • Validate spacing, alignment, and internal tolerances against specifications
  • Compare as-built data to CAD models
  • Ensure compliance with strict defense performance standards

For systems where reliability is non-negotiable—such as avionics, missile guidance circuits, and ruggedized battlefield electronics—these measurements are essential.

 

Reducing Failure Analysis Time for Defense Programs

Time is often the most valuable resource in defense programs. Rapid root-cause identification can prevent delays, reduce program risk, and keep production on schedule.

CT significantly shortens the failure analysis timeline by:

  • Eliminating the need for multiple destructive cross-sections
  • Providing a complete 3D model that can be inspected from any angle
  • Allowing cross-functional teams to collaborate using shared datasets
  • Enabling digital archiving for long-term reliability studies

With CT, defense engineers can often diagnose a problem in hours instead of days, improving readiness and minimizing rework.

 

Why Defense Organizations Choose North Star Imaging

North Star Imaging has become a trusted partner for defense contractors and OEMs who need confidence in every scan. NSI systems offer:

 

Ready to Strengthen Your Electronics Inspection?

If your defense electronics program demands greater clarity, faster failure analysis, and nondestructive access to complex internal features, CT imaging can transform your inspection process.

North Star Imaging’s experts are ready to help you understand your options, evaluate your assemblies, and select the right imaging solution.

Take the next step — fill out our customer contact form to speak with one of our CT specialists.

 

Talk to Our Experts

Tags

Blog

Up Next