ISTFA 2020 - International Symposium for Testing & Failure Analysis


Sunday Nov 15 - Thursday Nov 19


Pasadena, California

The Rise of MEMS and 3D Failure Analysis MEMS (Microelectromechanical Systems) sense physical phenomena and trigger action, and they have enabled a slew of useful, essential, and fun applications—the most common of which are found in smart phones, cars, printers, and wearables—but the application space keeps growing as costs decrease and new MEMS sensors are developed. Advances in packaging technologies, including wafer bonding, 3D (TSV/heterogeneous) integration, and die stacking have been essential in helping MEMS sensors proliferate. Where are MEMS going—new sensors, new applications, new fabrication and packaging processes? What challenges are created for failure analysis in packaging and new applications?

This site uses cookies and other tracking technologies to assist with navigation and your ability to provide feedback, analyze your use of our website, assist with our promotional and marketing efforts. See our Privacy Policy for more information